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集成電路芯片高低溫測試的應用

作(zuo)者：網絡編輯：瑞凱儀器來源：網絡(luo) 發布日期(qi)： 2020.06.13

近幾年來，本(ben)實驗(yan)室連續(xu)開展(zhan)了(le)大規模集(ji)成(cheng)電(dian)(dian)路(lu)的(de)(de)(de)新品檢測(ce)工作，如偵察運算電(dian)(dian)路(lu)、BCH 編譯(yi)碼器、CRT地址產生電(dian)(dian)路(lu)及接口電(dian)(dian)路(lu)等(deng)，基本(ben)上(shang)都是規模較大的(de)(de)(de)CMOS電(dian)(dian)路(lu)，對靜電(dian)(dian)敏感，工作速度較快(kuai)。在高(gao)、低(di)(di)溫(wen)(wen)電(dian)(dian)性(xing)能測(ce)試中成(cheng)功地采(cai)用了(le)該集(ji)成(cheng)電(dian)(dian)路(lu)高(gao)、低(di)(di)溫(wen)(wen)電(dian)(dian)性(xing)能測(ce)試系統，積累了(le)一些(xie)有益的(de)(de)(de)經驗(yan)。通過實際應用發現，必須注意(yi)以下一些(xie)具體的(de)(de)(de)環節(jie)，如測(ce)試板的(de)(de)(de)隔離、防潮，被(bei)測(ce)器件的(de)(de)(de)靜電(dian)(dian)保護，被(bei)測(ce)器件芯片溫(wen)(wen)度的(de)(de)(de)確(que)定等(deng)問題(ti)、才能快(kuai)速、準確(que)地完成(cheng)CMOSVLSI的(de)(de)(de)高(gao)、低(di)(di)溫(wen)(wen)電(dian)(dian)性(xing)能測(ce)試。

    在(zai)(zai)高(gao)、低(di)(di)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)測(ce)(ce)(ce)試時(shi)(shi)，將變溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)頭(tou)直接罩(zhao)在(zai)(zai)測(ce)(ce)(ce)試設備的(de)DUT板(ban)(ban)(ban)(ban)(ban)上(shang)，如(ru)果(guo)(guo)不采(cai)取隔離措施，測(ce)(ce)(ce)試設備的(de)DUT板(ban)(ban)(ban)(ban)(ban)將會處于+125℃的(de)高(gao)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)和-55℃的(de)低(di)(di)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)環(huan)境(jing)，勢必影(ying)響(xiang)測(ce)(ce)(ce)試系統(tong)的(de)性能和測(ce)(ce)(ce)試結(jie)果(guo)(guo)。在(zai)(zai)實(shi)際測(ce)(ce)(ce)試時(shi)(shi)，我們將一(yi)種(zhong)防靜(jing)電(dian)的(de)隔熱膠墊放在(zai)(zai)測(ce)(ce)(ce)試系統(tong)的(de)DUT板(ban)(ban)(ban)(ban)(ban)上(shang)，在(zai)(zai)測(ce)(ce)(ce)試夾具(ju)處開一(yi)小口將測(ce)(ce)(ce)試夾具(ju)露出(chu)，這(zhe)樣(yang)(yang)(yang)(yang)對測(ce)(ce)(ce)試系統(tong)的(de)DUT板(ban)(ban)(ban)(ban)(ban)起到一(yi)定的(de)保護作用，但如(ru)果(guo)(guo)DUT板(ban)(ban)(ban)(ban)(ban)長期處于高(gao)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)或低(di)(di)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)環(huan)境(jing)，隔熱膠墊的(de)作用將大為(wei)減弱，基于此(ci)，我們在(zai)(zai)設置(zhi)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)度(du)(du)控(kong)制(zhi)(zhi)程(cheng)(cheng)(cheng)序(xu)(xu)時(shi)(shi)對它進行了(le)調整。在(zai)(zai)高(gao)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)測(ce)(ce)(ce)試時(shi)(shi)，將溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)度(du)(du)控(kong)制(zhi)(zhi)程(cheng)(cheng)(cheng)序(xu)(xu)設為(wei)，在(zai)(zai)每個(ge)樣(yang)(yang)(yang)(yang)品(pin)(pin)測(ce)(ce)(ce)試完(wan)成換(huan)(huan)樣(yang)(yang)(yang)(yang)品(pin)(pin)前，讓變溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)頭(tou)向DUT板(ban)(ban)(ban)(ban)(ban)送(song)涼(liang)氣流10 s，然后才(cai)結(jie)束溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)控(kong)程(cheng)(cheng)(cheng)序(xu)(xu)換(huan)(huan)樣(yang)(yang)(yang)(yang)品(pin)(pin)，這(zhe)樣(yang)(yang)(yang)(yang)就(jiu)加速了(le)DUT板(ban)(ban)(ban)(ban)(ban)的(de)散(san)熱，將高(gao)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)對DUT板(ban)(ban)(ban)(ban)(ban)造成的(de)影(ying)響(xiang)降到。在(zai)(zai)低(di)(di)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)測(ce)(ce)(ce)試時(shi)(shi)，將溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)度(du)(du)控(kong)制(zhi)(zhi)程(cheng)(cheng)(cheng)序(xu)(xu)設為(wei)，在(zai)(zai)每個(ge)樣(yang)(yang)(yang)(yang)品(pin)(pin)測(ce)(ce)(ce)試完(wan)成換(huan)(huan)樣(yang)(yang)(yang)(yang)品(pin)(pin)前，讓變溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)頭(tou)向DUT板(ban)(ban)(ban)(ban)(ban)送(song)熱氣流10s，然后才(cai)結(jie)束溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)控(kong)程(cheng)(cheng)(cheng)序(xu)(xu)換(huan)(huan)樣(yang)(yang)(yang)(yang)品(pin)(pin)，這(zhe)樣(yang)(yang)(yang)(yang)DUT板(ban)(ban)(ban)(ban)(ban)上(shang)的(de)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)度(du)(du)已(yi)接近室溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)，在(zai)(zai)換(huan)(huan)樣(yang)(yang)(yang)(yang)品(pin)(pin)時(shi)(shi)就(jiu)避免了(le)環(huan)境(jing)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)度(du)(du)與低(di)(di)溫(wen)(wen)(wen)(wen)(wen)(wen)(wen)(wen)的(de)對流，造成DUT板(ban)(ban)(ban)(ban)(ban)凝(ning)水。對于被(bei)測(ce)(ce)(ce)器件的(de)防靜(jing)電(dian)措施有(you)：隔熱膠墊采(cai)用防靜(jing)電(dian)材料(liao);遮蓋被(bei)測(ce)(ce)(ce)器件的(de)小罩(zhao)由導熱防靜(jing)電(dian)材料(liao)所(suo)制(zhi)(zhi)。
    在用該高低溫(wen)(wen)(wen)循環試驗箱(xiang)做溫(wen)(wen)(wen)度(du)(du)(du)測(ce)(ce)(ce)試時(shi)(shi)，系統(tong)(tong)有溫(wen)(wen)(wen)度(du)(du)(du)傳感器(qi)叮測(ce)(ce)(ce)到(dao)(dao)器(qi)件底部的(de)(de)(de)溫(wen)(wen)(wen)度(du)(du)(du)，雖然氣流是(shi)垂(chui)直于DUT表(biao)面而(er)下(xia)，但DUT的(de)(de)(de)底部還是(shi)屬于器(qi)件表(biao)面，如何確定DUT芯(xin)片溫(wen)(wen)(wen)度(du)(du)(du)的(de)(de)(de)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)，是(shi)個比較復雜的(de)(de)(de)問題。因為DUT芯(xin)片溫(wen)(wen)(wen)度(du)(du)(du)的(de)(de)(de)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)受很多內素的(de)(de)(de)影響(xiang)，如DUT的(de)(de)(de)材料、形狀、尺寸(cun)，溫(wen)(wen)(wen)度(du)(du)(du)以及氣體流量的(de)(de)(de)大小(xiao)等因素的(de)(de)(de)影響(xiang)。不(bu)同的(de)(de)(de)器(qi)件芯(xin)片溫(wen)(wen)(wen)度(du)(du)(du)的(de)(de)(de)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)是(shi)不(bu)一樣的(de)(de)(de)溫(wen)(wen)(wen)度(du)(du)(du)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)是(shi)指系統(tong)(tong)變(bian)溫(wen)(wen)(wen)(升溫(wen)(wen)(wen)獲(huo)降溫(wen)(wen)(wen))開始，到(dao)(dao)建(jian)立(li)(li)(li)新(xin)的(de)(de)(de)熱平(ping)衡，即被測(ce)(ce)(ce)器(qi)件芯(xin)片溫(wen)(wen)(wen)度(du)(du)(du)達到(dao)(dao)設定值(zhi)這一段時(shi)(shi)間(jian)(jian)(jian)(jian)。某公(gong)司給出了1000Ω電阻(zu)溫(wen)(wen)(wen)度(du)(du)(du)探測(ce)(ce)(ce)器(qi)(RTD)的(de)(de)(de)溫(wen)(wen)(wen)度(du)(du)(du)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)曲線，如圖(tu)3所示。圖(tu)3表(biao)明不(bu)同的(de)(de)(de)RTD其溫(wen)(wen)(wen)度(du)(du)(du)建(jian)立(li)(li)(li)時(shi)(shi)間(jian)(jian)(jian)(jian)是(shi)不(bu)同的(de)(de)(de)。
    DUT芯片溫(wen)(wen)度(du)的(de)(de)(de)(de)建立(li)(li)時(shi)間(jian)(jian)對于(yu)高(gao)、低(di)溫(wen)(wen)測(ce)(ce)(ce)(ce)試(shi)(shi)是非常重要的(de)(de)(de)(de)指標(biao)，只有在(zai)大(da)于(yu)建立(li)(li)時(shi)間(jian)(jian)的(de)(de)(de)(de)時(shi)間(jian)(jian)段內測(ce)(ce)(ce)(ce)試(shi)(shi)，測(ce)(ce)(ce)(ce)試(shi)(shi)的(de)(de)(de)(de)數(shu)據才能(neng)真(zhen)正地反(fan)映(ying)設定溫(wen)(wen)度(du)點(dian)的(de)(de)(de)(de)性能(neng)及(ji)具(ju)有重復(fu)性。對于(yu)復(fu)雜的(de)(de)(de)(de)大(da)規模集(ji)成(cheng)電路，我們采(cai)取在(zai)開(kai)始高(gao)、低(di)溫(wen)(wen)測(ce)(ce)(ce)(ce)試(shi)(shi)前，通(tong)過(guo)反(fan)復(fu)試(shi)(shi)驗，確定被測(ce)(ce)(ce)(ce)器件芯片溫(wen)(wen)度(du)的(de)(de)(de)(de)建立(li)(li)時(shi)間(jian)(jian)。在(zai)熱流系統(tong)(tong)顯示達到設定溫(wen)(wen)度(du)開(kai)始，對被測(ce)(ce)(ce)(ce)器件進行多次電參數(shu)測(ce)(ce)(ce)(ce)試(shi)(shi)，當(dang)其電參數(shu)趨于(yu)穩定并具(ju)有可重復(fu)性時(shi)，將這段時(shi)間(jian)(jian)確定為DUT心片溫(wen)(wen)度(du)的(de)(de)(de)(de)建立(li)(li)時(shi)間(jian)(jian)。經(jing)過(guo)反(fan)復(fu)試(shi)(shi)驗發現，系統(tong)(tong)的(de)(de)(de)(de)溫(wen)(wen)度(du)傳感器測(ce)(ce)(ce)(ce)得的(de)(de)(de)(de)被測(ce)(ce)(ce)(ce)器件底部溫(wen)(wen)度(du)與芯片溫(wen)(wen)度(du)基本一致。

高低溫(wen)測試設備推薦

瑞凱RK-TH-408高低溫循環試驗箱（Temperature Cycling Test）是利用高溫低溫循環變化測試來評估集成電路IC芯片等產品對溫度變化的抵抗能力。主要是利用高溫低溫循環變化，來測試電子元器件、半導體、IC芯片等產品上各層不同物質之熱膨脹俘數不同，而可能引起之故障機制。在此測試中因所用之溫度介質為氣相，故一般亦稱為air to air測試。

滿足標(biao)準

    瑞凱RK-TH-408高低溫(wen)循環試驗箱滿(man)足(zu)GB/T2423.1(IEC60068-2-1)；
    GB/T2423.2(IEC60068-2-2)；
    ISO16750；
    GB/T14710；
    GB/T13543；
    JESD22等系列(lie)標準中的溫度試(shi)驗(yan)。